05.08.2020 – Low loss integrated photonics supplier, LIGENTEC SA, was awarded a €3.6M project from the EU Horizon 2020 EIC Accelerator program.
The EIC Accelerator is a highly competitive and prestigious program, which is part of the European Innovation Council (EIC) pilot that supports top-class innovators and entrepreneurs in implementing high-risk and high-potential innovation ideas to lead new emerging markets and major changes in how business is done.
Photonics applications are predicted to increase tremendously over the next years, especially pushed from medical instrumentation & diagnostics, autonomous driving, quantum computing and communication. Photonic Integration, the ability to shrink complex optical systems on a small chip, is a key technology with an enabling and highly disruptive potential in those verticals, similar to what the electronic ICs did in the past. The market for silicon based Photonic Integrated Circuits is expected to reach €4 bn in 2024.
LIGENTEC has developed a unique thick Silicon Nitride (SiN) technology which enables the manufacturing of Photonic Integrated Circuits (PICs) at better performance and lower cost than common approaches. This EIC funding is awarded to support bootstrapped LIGENTEC in the industrialization and scale-up of it’s proprietary, low loss, thick SiN technology.
LIGENTEC is your manufacturing partner for low loss Photonic Integrated Circuits for customers in high-tech areas such as integrated quantum optics, LiDAR, sensors and microwave photonics. LIGENTEC commercializes all-nitride-core technology awarded with the PIC award at PIC International 2018. The technology uses thick film optical grade LPCVD deposited silicon nitride and optimized cladding to provide guaranteed performance in propagation loss. With the all-nitride (AN) technology LIGENTEC enables the customers to develop their products in the industrial revolution 4.0. The customers benefit from a clear path to volume production while obtaining the small quantities of wafers with the performance, short turn around of 2 month and high yield required at the early stage of proof of concept.
Source: Press Release