Kandou Closes $75 Million in Series D Funding

Kandou Closes $75 Million in Series D Funding

17.12.2021 – Kandou, an innovative leader in high-speed, energy-efficient, chip link solutions based in Lausanne, closed its Series D round of funding, resulting in $75 million raised in the round. The investment supports the ramp-up of Kandou’s first silicon product and the ongoing development of its signalling technology.

read more in startupticker